澳门新莆京游戏(中国)官方网站-Limited Company

COMPO has mastered key technology of producing ultra fine solder powders, meeting the demand of the rapid development of electronic assembly industry.

Applications

Precision assembly/packaging

Mini-LED

Advanced application process: jet printing, roll printing, transfer printing, etc.

Key features

Excellent spherical

Narrow particle size distribution

Low-oxygen content

Specification

 

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